Semiconductor Packaging News2h
China's lithography gains a glass half full, not half empty
Summary China's Ministry of Industry and Information Technology added two domestically-made lithography systems, a krypton fluoride (KrF) and argon fluoride (ArF) scanner, to its equipment adoption ...
Semiconductor Packaging News2h
Barriers To Chiplet Sockets
Summary Experts at the Design Automation Conference, hosted by Semiconductor Engineering, debated whether industry standards or customization will dri ...
Semiconductor Packaging News7h
Google to invest $1 billion in Thailand to build data center and accelerate AI growth
Google to invest $1 billion in Thailand to build data center and accelerate AI growth: Summary Google is investing $1 billion in Thailand to build its first data center in Chonbur ...
Semiconductor Packaging News7h
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework: Summary SEMI has partnered with NIST to develop a strategic roadmap ...
Semiconductor Packaging News7h
China is 10 Years Behind Taiwan On Chips: NSTC
Summary Taiwan's TSMC is at least 10 years ahead of China in advanced chip manufacturing, according to NSTC Minister Wu Cheng-wen. TSMC's 2-nanometer chips are set for mass production next year, while ...
Semiconductor Packaging News7h
Finally, a Flexible Semiconductor-Based Green Laser
NIST researchers have developed a compact device that fills the visible light "green gap" by generating the full spectrum of orange, yellow, and green laser wavelengths. This breakthrough opens new ...
Semiconductor Packaging News7h
Corner-Case Bug Hunting for RISC-V
The Wilson Research Report highlights that traditional test-based methods, such as directed and constrained random, struggle to catch complex bugs in RISC-V verification. Formal methods, particularly ...
Semiconductor Packaging News7h
Data Routing In Heterogeneous Chip Designs
Summary Design engineers face increasing challenges in routing data across heterogeneous systems. Ronen Perets of Cadence Design Systems highlights issues with multi-vendor chiplets, inconsistent ...
Semiconductor Packaging News5d
Axus Technology Delivers Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers
Axus Technology announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide ... Semiconductor Packaging News is ...
Semiconductor Packaging News1y
Siemens extends collaboration with TSMC to advance integrated circuit & systems design
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications ... Siemens Digital ...
Semiconductor Packaging News2mon
STMicroelectronics unveils new generation of silicon carbide power technology tailored for next-generation EV traction inverters
STMicroelectronics is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power ... The HFA80A automotive-grade ...
Semiconductor Packaging News1y
SONOTEC with Compact Flow Meter Series for Semiconductor Applications at ICPT
We are optimistic about the upcoming months, although the uncertainty on the markets continues to influence our daily decisions. In recent years, we have learned to act prudently and flexibly. We have ...