Archer Materials manufactures first chip that combines the company’s gFET sensors with electrical readout circuitry.

The device has an SPI interface with registers for storing the device configuration as well as internal mapping and PWM ...

"Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, ...

Aeluma and Thorlabs unveil large-diameter photonics wafer manufacturing platform that could accelerate quantum adoption.

The Thunder Series is available in directional and omnidirectional versions, with IP67-rated ABS enclosures protecting ...

The US orders a broad array of companies to stop shipping goods to China without a license including EDA vendors.

Nvidia has once again beaten Wall Street expectations with its quarterly earnings up 69 per cent at over $44bn.

Infineon unveils new family of radiation hardened Gallium Nitride (GaN) transistors, based on its CoolGan technology.

SEGGER’s line of J-Link debug probes can now be used to both download a program into and debug Allegro MicroSystems MCUs.

TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.

Rhopoint Components is now stocking the Cissoid CMT-PLA3SB12340A Silicon Carbide (SiC) MOSFET Intelligent Power Module.

Research suggests that the rapid growth in XR content consumption is set to put a major strain on existing networks.