"Advanced packaging is one of the primary vehicles for advancing compute density in AI clusters and cloud," said Will Chu, ...

Archer Materials manufactures first chip that combines the company’s gFET sensors with electrical readout circuitry.

The device has an SPI interface with registers for storing the device configuration as well as internal mapping and PWM ...

Aeluma and Thorlabs unveil large-diameter photonics wafer manufacturing platform that could accelerate quantum adoption.

The US orders a broad array of companies to stop shipping goods to China without a license including EDA vendors.

Nvidia has once again beaten Wall Street expectations with its quarterly earnings up 69 per cent at over $44bn.

The Thunder Series is available in directional and omnidirectional versions, with IP67-rated ABS enclosures protecting ...

Infineon unveils new family of radiation hardened Gallium Nitride (GaN) transistors, based on its CoolGan technology.

SEGGER’s line of J-Link debug probes can now be used to both download a program into and debug Allegro MicroSystems MCUs.

TSMC has announced that it will be establishing its first European Design Centre (EUDC) in Munich later this year.

How AI, IoT connectivity and advanced interactive voice control systems are improving the smart home experience.

At last year’s IEDM, imec reported a breakthrough in the hetero-integration of InP chiplets on a 300mm RF Si interposer, at ...