Semiconductor Packaging News3h
Google to invest $1 billion in Thailand to build data center and accelerate AI growth
Google to invest $1 billion in Thailand to build data center and accelerate AI growth: Summary Google is investing $1 billion in Thailand to build its first data center in Chonbur ...
Semiconductor Packaging News3h
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework
SEMI Consortium to Develop Cybersecurity Strategy and Roadmap for the Semiconductor Industry in NIST Framework: Summary SEMI has partnered with NIST to develop a strategic roadmap ...
Semiconductor Packaging News3h
Finally, a Flexible Semiconductor-Based Green Laser
NIST researchers have developed a compact device that fills the visible light "green gap" by generating the full spectrum of orange, yellow, and green laser wavelengths. This breakthrough opens new ...
Semiconductor Packaging News3h
Corner-Case Bug Hunting for RISC-V
The Wilson Research Report highlights that traditional test-based methods, such as directed and constrained random, struggle to catch complex bugs in RISC-V verification. Formal methods, particularly ...
Semiconductor Packaging News3h
Data Routing In Heterogeneous Chip Designs
Summary Design engineers face increasing challenges in routing data across heterogeneous systems. Ronen Perets of Cadence Design Systems highlights issues with multi-vendor chiplets, inconsistent ...
Semiconductor Packaging News3h
China is 10 years behind Taiwan on chips: NSTC
Summary Taiwan's TSMC is at least 10 years ahead of China in advanced chip manufacturing, according to NSTC Minister Wu Cheng-wen. TSMC's 2-nanometer chips are set for mass production next year, while ...
Semiconductor Packaging News21h
Semiconductor Industry to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years
Semiconductor Industry to Invest $400 Billion in 300mm Fab Equipment Over Next Three Years: Summary Global spending on 300mm fab equipment is set to hit $400 billion from 2025 to ...
Semiconductor Packaging News5d
Axus Technology Delivers Lowest Cost of Ownership for CMP Processes on 200mm SiC Wafers
Axus Technology announced its flagship Capstone CS200 platform tools offer the industry’s lowest cost of ownership (CoO) for CMP processes on 200mm silicon carbide ... Semiconductor Packaging News is ...
Semiconductor Packaging News1y
Siemens extends collaboration with TSMC to advance integrated circuit & systems design
Siemens Digital Industries Software today announced it has extended its longstanding collaboration with TSMC through multiple new development projects, product certifications ... Siemens Digital ...
Semiconductor Packaging News2mon
STMicroelectronics unveils new generation of silicon carbide power technology tailored for next-generation EV traction inverters
STMicroelectronics is introducing its fourth generation STPOWER silicon carbide (SiC) MOSFET technology. The Generation 4 technology brings new benchmarks in power ... The HFA80A automotive-grade ...
Semiconductor Packaging News1y
SONOTEC with Compact Flow Meter Series for Semiconductor Applications at ICPT
We are optimistic about the upcoming months, although the uncertainty on the markets continues to influence our daily decisions. In recent years, we have learned to act prudently and flexibly. We have ...
Semiconductor Packaging News5d
SkyWater Names Bassel Haddad as SVP & General Manager of Advanced Packaging
SkyWater Technology announced the appointment of Bassel Haddad as senior vice president and general manager of advanced packaging. Reporting to President and COO ... Semiconductor Packaging News is ...