LED specialist Nichia will exhibit its latest automotive lighting solutions at SIA Vision 2024 held from October 16-17 in ...

HexaTech, a subsidiary of Japanese firm Stanley Electric, has signed a multi-year contract with the US Defense Advanced Research Projects Agency (DARPA) as part of the agency’s new Ultra-Wide Bandgap ...

Raytheon, an RTX business, has been awarded a three-year, two-phase contract from DARPA to develop ultra-wide bandgap semiconductors, or UWBGS, based on diamond and AlN technology.

Since the company’s founding in 2018 in Massachusetts, the company has delivered industrial-scale TFLN PICs with a trusted ...

ClassOne Technology has announced that Georgia Institute of Technology (Georgia Tech) has selected a Solstice S8 single-wafer processing system for its advanced packaging R&D program.

Compound Semiconductor™ is an Angel Business Communications publication.

CRAIC says that by combining confocal Raman spectroscopy with cutting-edge imaging and analytical features, the Apollo M ...

Compound Semiconductor™ is an Angel Business Communications publication.

The US National Renewable Energy Laboratory (NREL) will be redesigning the traction inverter used in US ground combat ...

Japanese firms Denso and Rohm have announced plans to set up a semiconductor partnership focused on automotive applications. As part of this, Denso will acquire a portion of Rohm's shares.

The 8.5 µm pixel pitch technology is claimed to be the smallest infrared sensor candidate for future Automatic Emergency Braking (AEB) and Advanced Driver Assistance Systems (ADAS).