News and insights from imec ITF World 2025.

Researchers from Oak Ridge National Laboratory and National Cheng Kung University developed a technique called scanning ...

A technical paper titled “Uncovering the doping mechanism of nitric oxide in high-performance P-type WSe2 transistors” was ...

Heterogeneous integration — an umbrella term that covers many different applications and packaging requirements — holds the ...

When the via impedance value cannot be determined, evaluating the signal transmission provides a viable alternative.

Quickly screen large amounts of possible materials for specific properties and select promising candidates for deeper ...

This is particularly promising for cooling stacks of silicon, where the top of the stack can easily lose its heat to the ...

Determining the ideal etch conditions to remove rough areas of the line and space resist pattern after EUV exposure.

How advanced metallization—specifically molybdenum—is becoming a critical enabler for semiconductor manufacturing.

The switch to transformer models has increased AI-driven computing demand by a factor of 50 million over five years.

Coverage Path Planning for Thermal Interface Materials” was published by researchers at Karlsruhe Institute of Technology ...

The rate of change in AI algorithms complicates the decision-making process about what to put in software, and how flexible ...