MILPITAS, Calif. — February 7, 2024 — Worldwide silicon wafer shipments in 2023 decreased 14.3% to 12,602 million square inches while wafer revenue contracted 10.9% to $12.3 billion over the same ...

The Video LVDS SerDes Transmitter / Receiver IP Core provides a complete, easy-to-use Serializer/Deserializer (SerDes) solution to interface a wide variety of video host systems to Flat Panel displays ...

AUSTIN, Texas, May 2, 2018 — The DDR PHY Interface (DFI) Group today released version 5.0 of the specification for interfaces between high-speed memory controllers and physical (PHY) interfaces to ...

Acquisition enables System-on-a-Chip (SoC) designers to accelerate design closure and enhance functional and structural constraint correctness with industry-proven timing constraints management Plano, ...

An interesting data point presented by analyst Richard Wawrzyniak of the SHD Group highlighted the growing maturity and penetration of RISC-V technology: an expected flip from license-driven revenue ...

This strategic collaboration will leverage Synopsys' expertise in silicon IPs to assist in the development of bespoke AI silicon, forming the foundation for advanced compute clusters aimed at deliveri ...

In a landscape defined by AI acceleration , chiplet-based system integration, and upcoming post-quantum challenges, Secure-IC ...

The Samsung SAFE™ program is designed to foster close collaboration between Samsung Foundry and its partners, encouraging innovation and efficiency across the semiconductor design ecosystem. By ...

In a keynote speech at the RISC-V Summit Europe 2025 in Paris, Emmanuel Till-Vattier, VP of sales EMEA at Codasip, presented a brief product update, including new possibilities for fast migration from ...

The future of AI compute is being built on Arm. AI continues to transform every major market — from the largest datacenters to the smallest devices, such as earbuds — intensifying the demands on ...

HSINCHU, Taiwan, R.O.C., May 13, 2025 – The TSMC (TWSE: 2330, NYSE: TSM) Board of Directors today held a meeting, which passed the following resolutions: ...

The report states that memory companies are taking a cautious approach to adopting high-NA EUV technology, largely due to their long-term DRAM roadmaps. According to plans from Samsung and SK hynix, ...