How a systematic approach to embedded device software updating can help to meet EU security requirements. By George Grey ...

At the heart of the collaboration is the GW16159, an industrial-grade M.2 Wi-Fi HaLow card designed and manufactured by ...

The ISO/SAE 21434 certification of the MICROSAR HSM firmware confirms the use of state-of-the-art processes in automotive ...

ST introduces the STDRIVE102H and STDRIVE102BH, new integrated gate drivers for three-phase brushless motor control.

GlobalFoundries to invest $16 billion to expand its semiconductor manufacturing and advanced packaging capabilities.

GENESIS Project to develop more sustainable processes and technologies for the semiconductor-manufacturing industry.

Even after three years of mass production, Samsung is said to be struggling to raise 3nm yields above 50 per cent.

Alphawave Semi, a developer of high-speed connectivity and compute silicon for technology infrastructure, has taped out one ...

Softbank and Intel are developing a new large-capacity memory that will reduce power consumption compared to HBM.

Infineon announces collaboration with Typhoon HIL, a provider of Hardware-in-the-Loop (HIL) simulation solutions.

First image sensor to directly convert X-rays into electronic signals using quantum dots (QDs) on a CMOS platform.

Combining optical and microwave signal processing on a single silicon chip the research groups have integrated high-speed ...